Digital Design Manager

📍 Job Overview

Job Title: Digital Design Manager

Company: Astera Labs

Location: Toronto, Ontario, Canada

Job Type: Full-time

Category: Engineering - Digital Design / DFT

Date Posted: 2026-09-15

Experience Level: 10+ years

Remote Status: On-site

🚀 Role Summary

• Lead day-to-day Design for Test (DFT) architecture and execution for Astera Labs' signal-conditioning products, ensuring high-quality silicon for rack-scale AI infrastructure.

• Partner with design, verification, physical design, packaging, product engineering, and manufacturing teams to enhance coverage, yield, diagnostics, and production readiness for advanced multi-die products.

• Establish practical DFT methodologies for high-speed PCIe and Ethernet signal-conditioning products, focusing on SerDes physical-layer performance, signal integrity, and production robustness.

• Provide hands-on technical ownership, mentor DFT engineers, and directly influence the development of connectivity solutions for next-generation AI systems.

📝 Enhancement Note: The job title "Digital Design Manager" combined with the responsibilities clearly indicates a focus on the Design for Test (DFT) domain within digital semiconductor design. The emphasis on signal-conditioning products, PCIe, Ethernet, and SerDes suggests a specialization in high-speed interconnect technologies critical for AI infrastructure.

📈 Primary Responsibilities

• DFT Architecture & Planning:

  • Define comprehensive DFT plans for signal-conditioning products, specifically addressing high-speed PCIe and Ethernet connectivity and complex advanced multi-die packaging configurations.
  • Develop robust test-access, coverage, observability, and diagnostic strategies tailored for die-to-die interfaces, silicon interposers, and overall package-level integration.
  • Collaborate closely with RTL design and physical design teams to meticulously balance DFT-related area overhead, timing constraints, routing complexity, and overall manufacturability.

• DFT Implementation & Silicon Readiness:

  • Drive the implementation of scan insertion, Automatic Test Pattern Generation (ATPG), test compression, Memory Built-In Self-Test (MBIST), Logic Built-In Self-Test (LBIST), Joint Test Action Group (JTAG), and Integrated JTAG (IJTAG) requirements.
  • Establish and track coverage targets, meticulously reviewing ATPG results, pattern quality, test time efficiency, and Application-Specific Integrated Circuit (ASIC) Test Equipment (ATE) cost implications.
  • Provide critical support throughout the ASIC lifecycle, including tape-out, wafer sort, packaged-device testing, silicon bring-up, characterization, and the production ramp phase.

• Quality, Yield & Diagnostics:

  • Partner with product engineering, manufacturing, assembly, and test engineering teams to drive yield learning initiatives, conduct failure analysis, and resolve root-cause issues effectively.
  • Develop sophisticated pre-bond, post-bond, and package-level test methodologies to ensure known-good-die (KGD) screening and support advanced packaging requirements.
  • Continuously improve diagnostic capabilities to pinpoint and resolve issues at the silicon, package, and system levels.

• Technical Leadership & Collaboration:

  • Mentor and guide junior DFT engineers, ensuring coordinated execution across all product development milestones.

  • Actively engage with Outsourced Semiconductor Assembly and Test (OSAT) partners, ATE vendors, packaging collaborators, and internal stakeholders to resolve complex technical challenges and maintain project schedules.

  • Clearly and concisely communicate risks, technical trade-offs, and strategic recommendations to cross-functional teams.

📝 Enhancement Note: The responsibilities clearly delineate a senior-level DFT role requiring strategic planning, hands-on execution, and leadership. The emphasis on "advanced multi-die packaging," "die-to-die interfaces," and "SerDes physical-layer performance" highlights the cutting-edge nature of the work, requiring deep expertise beyond standard DFT practices.

🎓 Skills & Qualifications

Education:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a closely related technical field.

• Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field is considered a strong plus. Experience:

• 10-15 years of progressive experience in Digital Design engineering, with a strong specialization in semiconductor design and test methodologies.

• Proven track record in leading DFT architecture and execution for complex ASIC designs. Required Skills:

• Deep, hands-on experience with core DFT methodologies including scan insertion, ATPG, test compression techniques, MBIST, LBIST, JTAG, and/or IJTAG implementation.

• Comprehensive understanding of the end-to-end ASIC design flow, from RTL (Register-Transfer Level) design through to GDSII (Geometric Data Stream II) layout and DFT signoff.

• Demonstrated experience utilizing industry-standard DFT EDA tools such as Synopsys DFT Compiler, TetraMAX, DFTMAX, or Siemens Tessent, and their equivalents.

• Solid understanding of high-speed signal conditioning principles, SerDes physical-layer behavior, signal integrity concepts, die-to-die connectivity, and the specific test requirements associated with advanced packaging. Preferred Skills:

• Experience with advanced packaging technologies such as 2.5D or 3D integration, silicon interposers, Through-Silicon Vias (TSVs), hybrid bonding, micro-bumps, chiplet architectures, or robust known-good-die (KGD) strategies.

• Knowledge of relevant industry standards for multi-die testing, including IEEE 1838, IEEE 1149.1 (JTAG), IEEE 1687 (Internal JTAG Access), and associated JEDEC standards.

• Practical experience with PCIe, Ethernet, UALink, and high-speed SerDes physical-layer validation or production test development.

• Familiarity with ATE platforms, wafer probe processes, OSAT engagement models, production test economics, and detailed yield analysis techniques.

📝 Enhancement Note: The requirement for 10-15 years of experience in a specialized field like DFT, coupled with the advanced topics mentioned (multi-die packaging, SerDes, chiplets), positions this as a senior or lead engineer role. The preference for advanced degrees and specific experience in emerging packaging technologies indicates a need for deep technical expertise and forward-thinking capabilities.

📊 Process & Systems Portfolio Requirements

Portfolio Essentials:

• Demonstrate a portfolio showcasing successful DFT architecture and implementation projects for complex semiconductor devices, ideally with high-speed interfaces.

• Include detailed case studies on DFT methodology development, coverage improvement strategies, and ATPG optimization for reduced test time and cost.

• Provide examples of your contribution to silicon bring-up, yield enhancement, and diagnostic improvements for previously launched products.

• Showcase experience in integrating DFT considerations early in the RTL design phase and collaborating with physical design for optimal results. Process Documentation:

• Evidence of defining and documenting comprehensive DFT plans, including scan architecture, ATPG strategies, and BIST integration.

• Examples of creating and maintaining test characterization reports, yield analysis documentation, and failure analysis reports related to DFT.

• Documentation illustrating the process of collaborating with cross-functional teams (design, verification, physical design, product engineering) on DFT-related tasks and issue resolution.

• Process flows detailing how DFT requirements were translated into actionable implementation steps and validated through simulation and silicon results.

📝 Enhancement Note: For a senior DFT role, a portfolio is crucial. It should highlight not just technical execution but also strategic thinking, problem-solving, and cross-functional collaboration. The emphasis on "advanced multi-die products" and "SerDes" implies a need for portfolio examples that address the unique DFT challenges these technologies present.

💵 Compensation & Benefits

Salary Range: CAD $198,000 to CAD $220,000 per year. This range is determined by factors including, but not limited to, candidate experience, demonstrated skills, the specific level of the role within the organization, and overall business needs.

Benefits:

• Discretionary bonus program, providing opportunities for additional compensation based on company and individual performance.

• Incentive programs designed to reward contributions and achievements within the engineering team.

• Comprehensive benefits package (details not specified, but typically includes health, dental, vision insurance, retirement plans, paid time off, etc., for full-time employees).

Working Hours: Standard full-time hours, typically 40 hours per week, with the expectation of flexibility to meet project deadlines and critical milestones in the fast-paced semiconductor industry.

📝 Enhancement Note: The provided salary range is specific to Toronto, Canada, and falls within the upper quartile for experienced semiconductor engineering roles, reflecting the high demand for specialized skills in DFT and advanced packaging. The inclusion of "discretionary bonus" and "incentives" suggests a performance-driven compensation structure.

🎯 Team & Company Context

🏢 Company Culture

Industry: Semiconductor Manufacturing - specializing in AI infrastructure connectivity solutions. Astera Labs is at the forefront of enabling AI by providing purpose-built connectivity platforms that integrate CXL®, Ethernet, NVLink, PCIe®, and UALink™ technologies. Their focus on rack-scale AI infrastructure positions them as a key player in the rapidly evolving AI hardware ecosystem.

Company Size: Astera Labs is a growing public company (NASDAQ: ALAB). While the exact number of employees isn't provided in the input, its recent IPO and focus on cutting-edge AI infrastructure suggest a dynamic, fast-paced environment with significant growth potential. This implies a culture that values innovation, agility, and rapid execution.

Founded: Astera Labs was founded in 2017. This relatively young age, combined with its rapid ascent to a public company, indicates a culture of ambition, rapid innovation, and a strong entrepreneurial spirit driving its success in the competitive semiconductor market.

Team Structure:

• The DFT team is likely a specialized group within the broader Digital Design or Engineering department. Given the "Manager" title, this role will lead a team of DFT engineers, potentially of varying experience levels.

• Reporting structure will likely be to a Director or VP of Engineering, with close collaboration across various engineering disciplines including RTL Design, Verification, Physical Design, and Product Engineering.

• Cross-functional collaboration is paramount, as DFT engineers must work intimately with almost every facet of the chip development lifecycle to ensure testability and manufacturability. Methodology:

• Data-driven decision-making is essential, particularly in yield analysis, failure root cause identification, and test cost optimization.

• Workflow planning and optimization will be key, focusing on efficient DFT implementation, ATPG generation, and test pattern validation to meet aggressive production schedules.

• Automation and efficiency practices are critical in DFT, from script development for tool flows to leveraging EDA tools for complex tasks like ATPG and compression.

Company Website: www.asteralabs.com

📝 Enhancement Note: Astera Labs' focus on AI infrastructure and its rapid growth as a public company suggest a high-performance culture. The "Digital Design Manager" role, specifically focused on DFT, will be integral to ensuring the quality and manufacturability of cutting-edge AI hardware components, requiring a strong emphasis on innovation and efficiency.

📈 Career & Growth Analysis

Operations Career Level: This role represents a senior-level management position within the semiconductor engineering domain, specifically focused on Digital Design for Test (DFT). It requires a blend of deep technical expertise and leadership capabilities. The responsibilities include strategic planning of DFT architecture, hands-on execution oversight, mentorship of engineers, and cross-functional collaboration to ensure silicon quality and production readiness.

Reporting Structure: The Digital Design Manager will likely report to a Director or Vice President of Engineering, with direct oversight of a team of DFT engineers. This position requires close interaction and collaboration with leads and engineers from other critical departments such as RTL Design, Verification, Physical Design, Packaging Engineering, and Product Engineering.

Operations Impact: The impact of this role is directly tied to the quality, yield, and cost-effectiveness of Astera Labs' advanced semiconductor products. Effective DFT strategies are crucial for:

• Ensuring the functionality and reliability of complex AI infrastructure chips.

• Minimizing manufacturing test costs and maximizing production yield, which directly impacts profitability.

• Accelerating time-to-market by ensuring efficient and robust test solutions.

• Enabling faster diagnosis of silicon issues, reducing debug time and development cycles.

• Supporting the successful ramp-up of new products into high-volume manufacturing. Growth Opportunities:

• Technical Specialization: Opportunity to deepen expertise in advanced DFT techniques for emerging technologies like chiplets, CXL, PCIe Gen6+, and high-speed SerDes, becoming a subject matter expert.

• Leadership Development: Potential to grow into higher-level management roles, such as Director of DFT or Head of Silicon Validation, overseeing larger teams and broader engineering responsibilities.

• Cross-Functional Leadership: Opportunity to lead cross-functional initiatives related to testability, yield improvement, and product quality across the entire semiconductor development lifecycle.

• Industry Influence: Contributing to the development of new DFT standards or best practices within the company and potentially the broader semiconductor industry through conferences or publications.

📝 Enhancement Note: The "Manager" title and 10-15 years of experience clearly place this role in a leadership capacity. The growth opportunities highlight a path for technical mastery and advancement within the engineering hierarchy, particularly relevant in a rapidly growing, high-tech company like Astera Labs.

🌐 Work Environment

Office Type: This role is designated as "On-site," indicating a need for the employee to work from Astera Labs' office in Toronto, Ontario, Canada. This setup facilitates direct collaboration, access to specialized lab equipment, and immediate interaction with on-site teams.

Office Location(s): The primary office location is Toronto, Ontario, Canada. This vibrant tech hub offers access to a rich talent pool and a thriving ecosystem of technology companies.

Workspace Context:

• The workspace will likely be in a modern office environment designed for collaboration among engineering teams. This includes access to shared workspaces, meeting rooms, and potentially specialized labs for silicon bring-up and testing.

• Availability of advanced EDA tools and high-performance computing resources will be standard for DFT engineers.

• Opportunities for direct, in-person interaction with colleagues across various engineering disciplines (RTL Design, Verification, Physical Design, Product Engineering) will be frequent, fostering a dynamic and communicative work environment.

Work Schedule: A standard 40-hour work week is expected, typical for full-time engineering roles. However, the nature of semiconductor development, especially with product launches and tape-outs, often requires flexibility and potential overtime to meet critical project deadlines and milestones.

📝 Enhancement Note: The "On-site" requirement is typical for roles involving physical hardware, lab access, and close-knit team collaboration in the semiconductor industry. Toronto's status as a tech hub provides a strong backdrop for talent acquisition and employee experience.

📄 Application & Portfolio Review Process

Interview Process:

• Initial Screening: A review of your resume and application to assess alignment with the required experience and skills, particularly in DFT architecture and execution.

• Technical Interview(s): In-depth discussions focusing on DFT methodologies, EDA tool proficiency (Synopsys, Siemens), ATPG strategies, MBIST/LBIST implementation, and experience with high-speed interfaces like PCIe and Ethernet. Expect scenario-based questions and problem-solving exercises related to DFT challenges.

• Portfolio Review: A dedicated session where you will present examples from your professional portfolio, detailing specific DFT projects, challenges overcome, methodologies applied, and quantifiable results (e.g., coverage improvements, yield impact, test time reduction).

• Managerial/Leadership Interview: Assessment of your leadership style, mentorship capabilities, experience managing engineering teams, cross-functional collaboration skills, and strategic thinking regarding DFT roadmap and execution.

• Final Interview: Potentially with senior leadership (e.g., VP of Engineering) to discuss overall fit with Astera Labs' culture, long-term vision, and strategic contributions.

Portfolio Review Tips:

• Structure: Organize your portfolio by project, clearly outlining the problem statement, your role and responsibilities, the DFT solutions implemented, the tools and methodologies used, and the measurable outcomes.

• Quantify Impact: Focus on demonstrating tangible results. Use metrics such as DFT coverage percentages, ATPG pattern counts, test time reduction, yield improvements, and cost savings.

• Highlight Complexity: Showcase your ability to handle complex designs, advanced packaging, and high-speed interfaces. Explain the unique DFT challenges presented by these technologies and how you addressed them.

• Storytelling: Be prepared to walk through your projects, explaining your thought process, technical decisions, and how you collaborated with other teams.

Challenge Preparation:

• DFT Scenario Questions: Be ready to discuss how you would approach DFT planning for a new chip with specific requirements (e.g., multi-die, high-speed SerDes).

• Tool Proficiency: Be prepared to discuss your experience with specific DFT tools and how you've leveraged them to solve complex problems.

• Yield & Diagnostics: Expect questions about your experience in yield analysis, failure diagnosis, and how DFT contributes to these processes.

• Leadership & Mentorship: Prepare examples of how you have mentored junior engineers, managed projects, and collaborated effectively with non-DFT teams.

📝 Enhancement Note: The emphasis on portfolio review and specific interview tips for DFT roles underscores the technical depth required. Candidates should be ready to demonstrate not only theoretical knowledge but also practical application and leadership in managing complex DFT challenges.

🛠 Tools & Technology Stack

Primary Tools:

• DFT EDA Suites: Synopsys DFT Compiler, TetraMAX, DFTMAX; Siemens Tessent (including ATPG, Scan, MBIST, IJTAG modules). Proficiency with at least one major suite is essential.

• Simulation Tools: Experience with RTL simulators (e.g., Synopsys VCS, Cadence Xcelium) for DFT verification.

• Static Timing Analysis (STA) Tools: Familiarity with STA tools (e.g., Synopsys PrimeTime) for analyzing DFT-related timing impacts.

• Scripting Languages: Strong proficiency in Tcl, Perl, or Python for automating DFT flows and tool interactions.

Analytics & Reporting:

• DFT Coverage Analysis Tools: Tools integrated within EDA suites or custom scripts to analyze and report on scan and ATPG coverage metrics.

• Pattern Generation & Debug Tools: Tools for generating, viewing, and debugging ATPG patterns.

• Yield Analysis Tools: Familiarity with tools used for analyzing wafer sort and final test data to identify yield detractors.

CRM & Automation:

• Version Control Systems: Git, Perforce for managing design files and DFT scripts.

• Project Management Tools: Tools like Jira or Asana for tracking DFT tasks and project progress.

• Data Analysis Platforms: While not explicitly mentioned, experience with data analysis tools for interpreting test results and yield data might be beneficial.

📝 Enhancement Note: This section highlights the core EDA tools and scripting skills critical for a DFT Manager. The emphasis on Synopsys and Siemens Tessent reflects industry standards. The mention of "advanced multi-die products" and "high-speed SerDes" implies that familiarity with tools supporting these specific technologies (e.g., advanced ATPG for parallel interfaces, MBIST for complex memory structures) is highly advantageous.

👥 Team Culture & Values

Operations Values:

• Innovation & Excellence: A drive to develop cutting-edge DFT solutions that push the boundaries of testability for advanced semiconductor technologies, particularly in AI infrastructure.

• Collaboration & Teamwork: A strong emphasis on working effectively across diverse engineering teams (Design, Verification, Physical Design, Product Engineering, Manufacturing) to achieve common goals.

• Quality & Reliability: A commitment to delivering high-quality, robust silicon that meets stringent performance and reliability standards for demanding AI applications.

• Efficiency & Optimization: A focus on optimizing test processes to reduce test time, improve yield, and lower manufacturing costs without compromising quality.

• Data-Driven Decision Making: Utilizing data from simulations, silicon results, and yield analysis to inform DFT strategies and problem-solving.

Collaboration Style:

• Proactive & Integrated: DFT engineers are expected to be involved early in the design process, proactively identifying and addressing testability concerns rather than acting as a reactive function.

• Transparent Communication: Open and clear communication of risks, trade-offs, and technical recommendations to all stakeholders, ensuring alignment and informed decision-making.

• Knowledge Sharing: A culture that encourages sharing best practices, lessons learned, and technical expertise within the DFT team and across other engineering groups.

• Problem-Solving Orientation: A collective approach to tackling complex technical challenges, leveraging the collective knowledge and experience of the team and cross-functional partners.

📝 Enhancement Note: The values and collaboration style described are typical of high-performing engineering teams in the semiconductor industry, emphasizing technical rigor, cross-functional synergy, and a commitment to quality and efficiency. For this role, demonstrating how your DFT approach aligns with these values will be key.

⚡ Challenges & Growth Opportunities

Challenges:

• Complexity of Advanced Packaging: Designing DFT for multi-die, chiplet-based architectures presents unique challenges related to inter-die communication testing, KGD screening, and package-level diagnostics.

• High-Speed Interfaces: Ensuring testability and diagnostics for high-speed SerDes, PCIe, and Ethernet interfaces requires specialized DFT techniques and tools, often pushing the limits of existing methodologies.

• Balancing DFT Overhead: Finding the optimal balance between DFT implementation (area, timing, power) and achieving high test coverage, yield, and diagnostic capabilities is a perpetual challenge.

• Rapid Technological Evolution: Keeping pace with the fast-evolving AI hardware landscape, new interconnect standards, and advanced manufacturing processes requires continuous learning and adaptation of DFT strategies.

• Cross-Functional Alignment: Effectively coordinating DFT efforts across multiple geographically dispersed or functionally distinct teams (design, verification, physical design, external partners) can be complex.

Learning & Development Opportunities:

• Advanced DFT Techniques: Deepen expertise in areas like hierarchical DFT, compressed ATPG, advanced MBIST, and debug methodologies for complex SoCs and multi-die systems.

• Industry Standards & Emerging Tech: Gain in-depth knowledge of evolving standards like IEEE 1838 for multi-die testing and explore their application in products.

• Leadership and Mentorship: Develop management and leadership skills through direct team management, project leadership, and mentoring junior engineers.

• Cross-Functional Exposure: Gain broader understanding of the ASIC lifecycle, from RTL to manufacturing, by working closely with other engineering disciplines.

• Industry Engagement: Opportunities to attend industry conferences (e.g., DAC, ITC) and potentially contribute to technical papers or presentations.

📝 Enhancement Note: The identified challenges are specific to the cutting-edge nature of Astera Labs' products and the semiconductor industry. The growth opportunities are well-aligned with advancing one's career in DFT, offering both technical depth and leadership progression.

💡 Interview Preparation

Strategy Questions:

• DFT Strategy for New Product: "How would you approach DFT architecture planning for a new multi-die product featuring high-speed PCIe 6.0 interfaces and CXL connectivity? What are your primary concerns and how would you mitigate them?" (Focus on early planning, coverage targets, KGD strategy, SerDes test).

• Yield Improvement through DFT: "Describe a situation where your DFT strategy directly contributed to improving silicon yield or reducing test costs. What steps did you take, and what was the impact?" (Prepare a specific case study demonstrating analytical and problem-solving skills).

• Collaboration & Communication: "How do you ensure effective collaboration between the DFT team and RTL design, verification, and physical design teams? Describe a time you had to resolve a significant disagreement or technical trade-off with another team." (Highlight your communication, negotiation, and cross-functional partnership skills).

Company & Culture Questions:

• Astera Labs' Mission: "What interests you about Astera Labs and our mission in AI infrastructure connectivity?" (Research Astera Labs' products, market position, and recent news).

• Team Dynamics: "How do you foster a collaborative and high-performing environment within your engineering team?" (Discuss your management style, mentorship approach, and how you build team cohesion).

• Impact Measurement: "How do you measure the success and impact of DFT initiatives within a semiconductor development cycle?" (Focus on metrics like coverage, test time, yield, ATE cost, and diagnostic effectiveness).

Portfolio Presentation Strategy:

• Select Key Projects: Choose 2-3 impactful projects that best showcase your DFT architecture, implementation, and leadership skills, ideally relevant to Astera Labs' focus areas (high-speed interfaces, advanced packaging).

• Problem-Solution-Result Framework: For each project, clearly articulate the problem/challenge, your proposed solution (DFT strategy, tools, methodologies), and the quantifiable results achieved.

• Visual Aids: Use diagrams, flowcharts, or simplified schematics to illustrate DFT architectures, scan chains, BIST structures, or test patterns where appropriate.

• Focus on Collaboration: Emphasize how you worked with other teams to achieve successful DFT integration and signoff.

• Be Prepared for Deep Dives: Anticipate detailed questions about your technical decisions, tool usage, and problem-solving approaches.

📝 Enhancement Note: The interview preparation guidance is tailored to a senior DFT Manager role. It emphasizes strategic thinking, practical problem-solving, and effective communication, reflecting the multifaceted nature of the position. Candidates should prepare specific examples and demonstrate a deep understanding of both technical DFT aspects and leadership responsibilities.

📌 Application Steps

To apply for this Digital Design Manager position:

• Submit your application through the provided link on the Astera Labs careers portal.

• Tailor Your Resume: Customize your resume to highlight your 10-15 years of experience in DFT architecture, execution, and leadership. Emphasize keywords such as DFT, ATPG, scan insertion, MBIST, JTAG, PCIe, Ethernet, SerDes, multi-die packaging, and experience with EDA tools like Synopsys DFT Compiler or Siemens Tessent. Quantify your achievements with metrics related to coverage, yield, or test time reduction.

• Prepare Your Portfolio: Curate a portfolio that showcases 2-3 significant DFT projects. For each project, clearly outline the challenges, your strategic approach, the methodologies and tools used, and the tangible results achieved. Be ready to present this portfolio during the interview process.

• Research Astera Labs: Thoroughly research Astera Labs' products, their role in AI infrastructure, their technology stack (CXL, PCIe, Ethernet), and their company culture. Understand their market position and recent developments.

• Practice Interview Questions: Prepare answers to common DFT technical questions, leadership scenarios, and questions about your portfolio. Practice articulating your DFT strategy and problem-solving approach clearly and concisely.

⚠️ Important Notice: This enhanced job description includes AI-generated insights and operations industry-standard assumptions. All details should be verified directly with the hiring organization before making application decisions.