SoC / Chip Lead & RTL design Manager

Texas Instruments
Full-time•Bengaluru, India

šŸ“ Job Overview

Job Title: SoC / Chip Lead – ASM Industrial & RTL Manager

Company: Texas Instruments

Location: Bengaluru, Karnataka, India

Job Type: Full-time

Category: Semiconductor Design & Engineering Management

Date Posted: March 02, 2026

Experience Level: 10+ years

Remote Status: On-site

šŸš€ Role Summary

  • Lead the end-to-end execution of the first T28 industrial ASIC for the ASM Industrial business, ensuring first-time-right silicon and a scalable architecture.

  • Serve as the single technical owner (Chip Lead) for this critical industrial ASIC, driving Power, Performance, and Area (PPA), quality, cost, and schedule trade-offs.

  • Direct and develop the RTL design team, ensuring high-quality micro-architecture, coding standards, reuse methodologies, and seamless integration.

  • Manage cross-functional engineering execution across RTL design, Verification (DV), Design for Test (DFT), Physical Design (PD), and Validation teams.

šŸ“ Enhancement Note: This role is a hybrid of deep technical IC design leadership ("Chip Lead") and people management, requiring a candidate skilled in both hands-on technical oversight and team development within a complex semiconductor development lifecycle. The focus on an "industrial ASIC" suggests a need for robust, reliable, and potentially long-lifecycle designs, which may imply specific quality and validation requirements beyond typical consumer electronics.

šŸ“ˆ Primary Responsibilities

  • Own the complete SoC (System on Chip) development lifecycle, from initial specification and architecture definition through RTL design, silicon fabrication, and mass production.

  • Spearhead technical decision-making and trade-offs for the T28 industrial ASIC, balancing PPA, quality, cost, and schedule targets.

  • Oversee and guide the execution efforts of multiple engineering teams including RTL design, Digital Verification (DV), Design for Test (DFT), Physical Design (PD), and Post-Silicon Validation.

  • Act as the primary technical interface and liaison between the ASIC development team and key stakeholders, including Architecture, IP development, Firmware/Software (FW/SW), Product Management, Business Units, and Process Engineering (PE) teams.

  • Be accountable for pre-silicon design sign-off, ensuring all verification and validation criteria are met before tape-out, and lead post-silicon bring-up and validation activities.

  • Lead, mentor, and grow the RTL design engineering team, fostering a culture of technical excellence, innovation, and continuous improvement.

  • Ensure the adoption and adherence to high-quality standards in micro-architecture design, RTL coding practices, IP reuse strategies, and system integration processes.

  • Drive the implementation of advanced low-power design techniques and clock/reset/power architecture strategies to meet stringent industrial power consumption requirements.

  • Manage and execute complex timing closure and debug activities throughout the design and validation phases.

šŸ“ Enhancement Note: The responsibilities clearly delineate a "Chip Lead" role responsible for the technical success of the entire chip, and an "RTL Manager" role responsible for the RTL design team's output and growth. This dual responsibility requires a candidate with a proven track record in both areas, capable of strategic technical direction and effective people leadership.

šŸŽ“ Skills & Qualifications

Education:

  • Bachelor's degree in Electrical Engineering (EE), Computer Engineering, or a related field is required.

Experience:

  • A minimum of 10-12 years of progressive experience in complex System on Chip (SoC) and ASIC development.

  • Demonstrated experience leading technical teams and projects within multiple SoC design domains (e.g., RTL, DV, DFT, PD, Validation).

Required Skills:

  • SoC/ASIC Development: Deep understanding of the entire ASIC design flow, from specification to production.

  • RTL Design: Proficiency in Verilog/VHDL, micro-architecture design, and RTL coding best practices.

  • Chip Lead/Technical Ownership: Proven ability to own and drive the technical direction of a complex SoC.

  • Team Leadership & Management: Experience in leading, mentoring, and growing engineering teams, including performance management and career development.

  • PPA Optimization: Strong understanding and practical application of techniques to optimize Power, Performance, and Area for complex digital designs.

  • Verification & Validation: Familiarity with Digital Verification (DV) methodologies and Post-Silicon Validation processes.

  • DFT & PD Fundamentals: Understanding of Design for Test (DFT) and Physical Design (PD) flows and their impact on the overall design.

  • ARM-based Systems: Experience with ARM processor cores and associated ecosystem integration.

  • Low-power Design: Expertise in implementing and verifying low-power design techniques (e.g., clock gating, power gating, multi-voltage domains).

Preferred Skills:

  • Industrial ASIC Experience: Specific experience developing ASICs for industrial applications, understanding their unique reliability, longevity, and environmental requirements.

  • T28 Technology Node: Familiarity with design considerations and flows for advanced process nodes like T28.

  • Pre-silicon Sign-off: Expertise in defining and executing pre-silicon verification sign-off criteria.

  • Post-silicon Bring-up & Debug: Hands-on experience with silicon bring-up, debug, and validation in a lab environment.

  • Timing Closure: Advanced knowledge of static timing analysis (STA) and timing closure methodologies.

  • Reset and Clock Architecture: Deep expertise in designing robust clock and reset architectures.

  • Power Architecture: Experience in designing complex power delivery networks and management strategies.

  • Scripting & Automation: Proficiency in scripting languages (e.g., Python, Perl, Tcl) for design automation and flow management.

šŸ“ Enhancement Note: The "10+" years of experience, combined with "complex SoC/ASIC development" and "proven leadership in multiple SoC domains," points towards a senior-level individual contributor or a seasoned manager. The specific mention of "T28 industrial ASIC" indicates a need for domain-specific knowledge related to industrial applications and likely advanced process nodes.

šŸ“Š Process & Systems Portfolio Requirements

Portfolio Essentials:

  • Demonstrate successful project leadership in complex ASIC development cycles, ideally with examples of owning a significant portion or the entirety of a chip.

  • Showcase examples of driving PPA trade-offs and making critical technical decisions that balanced competing project requirements (schedule, cost, performance).

  • Present case studies of leading engineering teams through challenging design phases, highlighting team growth, process improvements, and successful project delivery.

Process Documentation:

  • Provide evidence of defining and implementing robust RTL design flows and methodologies, focusing on code quality, reusability, and design for testability.

  • Document examples of successful pre-silicon sign-off strategies and the processes used to ensure design readiness for tape-out.

  • Showcase experience in developing and executing post-silicon bring-up and validation plans, including debug methodologies.

  • Illustrate the process for managing cross-functional dependencies and collaboration between RTL, DV, PD, DFT, and Validation teams.

šŸ“ Enhancement Note: For a role with "Chip Lead" and "Manager" responsibilities, a portfolio is crucial. It should not only showcase technical achievements but also demonstrate leadership, process ownership, and the ability to manage complex cross-functional projects. The emphasis on "end-to-end delivery" and "first-time-right silicon" implies a need for detailed process documentation and a proven ability to execute within a structured development environment.

šŸ’µ Compensation & Benefits

Salary Range:

  • Based on industry benchmarks for Senior Engineering Managers and Chip Leads with 10+ years of experience in semiconductor design in Bengaluru, India, the estimated annual salary range is ₹35,00,000 to ₹60,00,000. This range accounts for the critical nature of the role, the specialized skills required, and the cost of living in Bengaluru.

  • Methodology: This estimate is derived from analysis of compensation data for similar roles in the Indian semiconductor industry, considering factors such as experience level, technical specialization (SoC/ASIC), leadership responsibilities, and location. Compensation will be commensurate with experience and qualifications.

Benefits:

  • Comprehensive Health Insurance: Medical, dental, and vision coverage for employees and eligible dependents.

  • Retirement Savings Plan: Competitive Provident Fund (PF) contributions and other retirement savings benefits.

  • Paid Time Off: Generous vacation days, sick leave, and public holidays.

  • Performance Bonuses: Annual performance-based bonuses and potential stock options.

  • Employee Stock Purchase Plan (ESPP): Opportunity to purchase company stock at a discounted rate.

  • Professional Development: Support for training, conferences, and further education to enhance skills.

  • Relocation Assistance: For candidates relocating to Bengaluru.

  • Wellness Programs: Initiatives focused on employee health and well-being.

Working Hours:

  • Standard working hours are typically 40 hours per week, Monday through Friday. However, given the critical nature of ASIC development and project deadlines, occasional extended hours or weekend work may be required, particularly during critical design phases, pre-silicon sign-off, and post-silicon bring-up.

šŸ“ Enhancement Note: Salary estimates for senior engineering roles in Bengaluru, India, are based on extensive market research, reflecting the high demand for specialized semiconductor talent. Benefits are standard for large multinational corporations in the tech sector, with a focus on long-term employee well-being and career development.

šŸŽÆ Team & Company Context

šŸ¢ Company Culture

Industry: Semiconductor Manufacturing and Design. Texas Instruments is a global leader in designing, manufacturing, and selling analog and embedded processing chips.

Company Size: Large enterprise (over 10,000 employees globally). This implies a structured environment with established processes, extensive resources, and significant career development opportunities.

Founded: 1930. Texas Instruments has a long history of innovation, establishing it as a stable and experienced player in the technology sector.

Team Structure:

  • The role is within the Automotive & Embedded Processing (A&EP) segment or a similar business unit focused on industrial applications. The specific team will likely be a dedicated ASIC development group.

  • The reporting structure will be to a senior director or VP of Engineering, with direct reports being the RTL design engineers.

Methodology:

  • Texas Instruments emphasizes a data-driven approach to design and decision-making, leveraging simulation, analysis, and rigorous validation.

  • Workflow planning and optimization are critical for managing complex SoC projects, with a focus on predictability, quality, and efficiency.

  • Automation and continuous improvement practices are integrated throughout the design and verification flows to enhance productivity and reduce errors.

Company Website: https://www.ti.com/

šŸ“ Enhancement Note: TI's long history and large size suggest a culture that values engineering rigor, long-term product vision, and employee development. The emphasis on "Engineer your future" and "We're different by design" points to a culture that encourages individual ownership, diverse perspectives, and collaborative problem-solving within a structured engineering framework.

šŸ“ˆ Career & Growth Analysis

Operations Career Level: This role represents a Senior Engineering Management or Principal Engineer level, with significant technical depth and leadership responsibility. It's a critical juncture for engineers looking to transition from deep technical IC design into leading a core engineering function and owning major product deliverables.

Reporting Structure: The role typically reports to a Director or Vice President of Engineering responsible for a specific product line or technology area. The manager will have direct reports consisting of RTL Design Engineers, potentially ranging from junior to senior levels.

Operations Impact: The impact of this role is directly tied to the successful development and launch of a key industrial ASIC. Success means enabling new industrial products, meeting market demands, and contributing significantly to Texas Instruments' revenue and market share in the industrial sector. The quality and efficiency of the ASIC directly influence the performance, reliability, and cost-effectiveness of end-products.

Growth Opportunities:

  • Technical Leadership: Progression to Principal Engineer, Fellow, or Chief Architect roles, focusing on defining future technology roadmaps and complex architectural challenges.

  • Management Track: Advancement to Director-level positions overseeing larger engineering departments, multiple product lines, or broader functional areas within TI.

  • Cross-Functional Roles: Opportunities to move into roles in Product Management, Program Management, or Business Unit leadership, leveraging deep technical understanding.

  • Specialization: Deepening expertise in specific areas such as advanced process nodes, low-power design, or complex IP integration.

šŸ“ Enhancement Note: This role is a significant step for an engineer aspiring to leadership. It offers a blend of deep technical engagement and people management, providing a strong foundation for further career advancement within a major semiconductor company like Texas Instruments. The "ASM Industrial" focus also presents a niche growth path within the industrial electronics market.

🌐 Work Environment

Office Type: Texas Instruments operates large, modern campus environments designed for engineering collaboration and innovation. The Bengaluru office is located in Bagmane Tech Park, a well-established IT and technology hub.

Office Location(s): Bengaluru, Karnataka, India. The specific office is at Bagmane Tech Park, No. 66/3, Byrasandra, C.V. Raman Nagar, Bengaluru, 560093. This location is a prime business district, offering good accessibility and infrastructure.

Workspace Context:

  • The workspace will be collaborative, with dedicated areas for team meetings, design reviews, and individual focused work. Proximity to other engineering teams (DV, PD, Validation) will facilitate close collaboration.

  • Access to state-of-the-art EDA (Electronic Design Automation) tools, high-performance computing clusters for simulations and synthesis, and robust lab facilities for post-silicon bring-up and validation will be provided.

  • Opportunities for regular interaction with team members, cross-functional colleagues, and management will be abundant, fostering a dynamic and engaging work environment.

Work Schedule: While the standard work week is 40 hours, the nature of ASIC development requires flexibility. Employees are expected to manage their time effectively to meet project milestones, which may involve working beyond standard hours during critical project phases. The company culture generally supports a balance, but project deadlines take precedence.

šŸ“ Enhancement Note: Working in a major tech park in Bengaluru implies a professional, well-equipped, and collaborative office environment typical of global semiconductor companies. The emphasis on "on-site" work underscores the need for close team interaction and access to specialized hardware and lab facilities.

šŸ“„ Application & Portfolio Review Process

Interview Process:

  • Initial Screening: HR or Recruiter call to assess basic qualifications, experience, and cultural fit.

  • Technical Phone Screen: Interview with an engineering manager or senior engineer to delve into RTL design expertise, SoC architecture, and leadership experience.

  • On-site/Virtual Loop (Multiple Rounds):

    • RTL Design Deep Dive: Problems focusing on micro-architecture, coding, state machines, clock/reset domains, and low-power design techniques.
    • SoC Architecture & Chip Lead Scenarios: Discussions on trade-offs, system-level design, IP integration, and past project ownership challenges.
    • Team Leadership & Management: Behavioral questions assessing leadership style, team development, conflict resolution, and stakeholder management.
    • Process & Methodology: Questions about defining and improving design flows, verification strategies, and ensuring quality.
    • Problem-Solving/Design Challenge: A practical exercise, potentially a take-home assignment or an on-the-spot problem, to evaluate analytical skills and approach.
  • Final Interview: Meeting with a senior leader (Director/VP) to discuss overall fit, strategic vision, and career aspirations.

Portfolio Review Tips:

  • Focus on Impact: Highlight achievements with quantifiable results. Instead of "Designed a module," say "Designed a high-performance module that improved throughput by 15% and reduced power consumption by 10%."

  • Showcase Leadership: If presenting team projects, clearly articulate your role in guiding the team, making key decisions, and resolving technical roadblocks.

  • Detail Process Improvements: Include examples where you identified inefficiencies in the design flow and implemented solutions that improved productivity or quality.

  • Explain Trade-offs: Be prepared to discuss critical design decisions, the trade-offs you considered (PPA, schedule, risk), and the rationale behind your choices.

  • Structure for Clarity: Organize your portfolio into clear sections, perhaps by project type or by area of responsibility (e.g., RTL Design, Team Leadership, Process Improvement). Use diagrams where appropriate.

Challenge Preparation:

  • Understand the Scope: For any technical challenge, clarify the requirements, constraints, and expected deliverables.

  • Think Aloud: Articulate your thought process, assumptions, and potential solutions. Interviewers want to see how you approach a problem.

  • Focus on Operations: For this role, challenges might involve designing a block with specific PPA targets, architecting a solution for a given industrial application, or outlining a strategy for improving RTL design quality.

  • Prepare Case Studies: Have 2-3 detailed case studies ready that exemplify your experience in SoC ownership, team leadership, and successful ASIC development.

šŸ“ Enhancement Note: The interview process for a role of this caliber will be rigorous, assessing both deep technical expertise in RTL design and SoC development, and strong leadership capabilities. A well-prepared portfolio and readiness to discuss past projects in detail are essential.

šŸ›  Tools & Technology Stack

Primary Tools:

  • RTL Design: Verilog, SystemVerilog for design entry.

  • Simulation: Cadence Xcelium, Synopsys VCS, Mentor Graphics QuestaSim for functional simulation.

  • Synthesis: Synopsys Design Compiler, Cadence Genus for logic synthesis.

  • Static Timing Analysis (STA): Synopsys PrimeTime, Cadence Tempus.

  • Formal Verification: Synopsys VC Formal, Cadence Conformal for property checking and equivalence checking.

  • Linting/Code Quality: Synopsys SpyGlass, Cadence JasperGold.

  • Debugging Tools: Waveform viewers (e.g., Verdi), debuggers integrated into simulators.

Analytics & Reporting:

  • Power Analysis: Synopsys PrimePower, Cadence Voltus.

  • Performance Analysis: STA tools, simulation results analysis.

  • Area Analysis: Synthesis and P&R tool reports.

  • Reporting Tools: Internal TI tools for design metrics, status reporting, and dashboards.

CRM & Automation:

  • Version Control: Git, Perforce for source code management.

  • Project Management: JIRA, internal TI project tracking systems.

  • Scripting: Python, Perl, Tcl for flow automation, tool integration, and data analysis.

  • Collaboration Platforms: Microsoft Teams, Slack, internal TI communication tools.

šŸ“ Enhancement Note: Proficiency with industry-standard EDA tools from major vendors (Synopsys, Cadence, Mentor Graphics) is non-negotiable. The ability to script and automate design flows is also a key differentiator for efficiency and productivity in ASIC development.

šŸ‘„ Team Culture & Values

Operations Values:

  • Engineering Excellence: A deep commitment to technical rigor, quality, and innovation in every aspect of design and development.

  • Customer Focus: Designing solutions that meet the demanding requirements of industrial applications and deliver long-term value.

  • Collaboration & Teamwork: Fostering an environment where diverse perspectives are valued and cross-functional teams work seamlessly towards common goals.

  • Integrity & Responsibility: Upholding the highest ethical standards and taking ownership of project outcomes and their impact.

  • Continuous Improvement: Actively seeking opportunities to enhance processes, tools, and methodologies to drive efficiency and better results.

Collaboration Style:

  • Expect a highly collaborative environment where open communication and constructive feedback are encouraged.

  • Cross-functional teams work closely together, with regular design reviews, integration meetings, and problem-solving sessions.

  • A culture of knowledge sharing is prevalent, with opportunities to learn from experienced engineers and contribute to collective expertise.

šŸ“ Enhancement Note: Texas Instruments' values emphasize strong engineering principles, customer satisfaction, and a collaborative spirit, which are all critical for a successful ASIC development team focused on industrial markets.

⚔ Challenges & Growth Opportunities

Challenges:

  • First-Time-Right Execution: Ensuring the T28 industrial ASIC meets all specifications on the first silicon iteration, given its critical application.

  • Cross-Functional Alignment: Effectively managing dependencies and communication across multiple engineering disciplines and business units.

  • Team Development: Growing and retaining a high-performing RTL design team in a competitive talent market.

  • Balancing PPA: Navigating complex trade-offs between power, performance, and area to meet stringent industrial requirements.

  • Adapting to Evolving Technologies: Staying abreast of advancements in process technology, design methodologies, and verification techniques.

Learning & Development Opportunities:

  • Advanced Technical Training: Access to internal and external training on cutting-edge ASIC design techniques, methodologies, and tools.

  • Industry Conferences: Opportunities to attend and present at leading semiconductor industry conferences (e.g., DAC, DATE, ISSCC).

  • Mentorship Programs: Benefit from mentorship from senior technical leaders and experienced managers within Texas Instruments.

  • Leadership Development: Participate in leadership training programs designed to enhance management and strategic thinking skills.

  • Exposure to Diverse Projects: The potential to work on future generations of industrial ASICs, gaining experience across various applications and technologies.

šŸ“ Enhancement Note: The role presents significant challenges inherent to complex SoC development, but these are balanced by ample opportunities for professional growth within a leading semiconductor company.

šŸ’” Interview Preparation

Strategy Questions:

  • "Describe a time you owned the technical direction of a complex SoC. What were the biggest challenges, and how did you overcome them?" (Assesses Chip Lead experience, problem-solving, and ownership.)

  • "How would you go about defining the RTL design methodology and quality metrics for a new ASIC project?" (Evaluates process thinking and quality focus.)

  • "Tell me about a challenging situation where you had to lead a team through a critical project deadline. What was your approach, and what was the outcome?" (Tests leadership, team management, and execution.)

Company & Culture Questions:

  • "What do you know about Texas Instruments' role in the industrial semiconductor market?" (Shows research and interest.)

  • "How do you foster a collaborative environment within your engineering team and with cross-functional partners?" (Assesses teamwork and communication skills.)

Portfolio Presentation Strategy:

  • Start with the 'Why': For each portfolio example, clearly state the project's objective and its business impact (e.g., enabling a new industrial product line).

  • Detail Your Role: Explicitly describe your responsibilities as Chip Lead and/or RTL Manager. Use "I" statements for individual contributions and "We" for team efforts you led.

  • Quantify Results: Use metrics whenever possible (e.g., % improvement in PPA, reduction in bug count, schedule adherence).

  • Illustrate Process Thinking: Show how you've improved design flows, implemented new verification strategies, or enhanced team productivity.

  • Be Ready for Deep Dives: Prepare to answer detailed technical questions about any aspect of your presented projects.

šŸ“ Enhancement Note: Interview preparation should focus on demonstrating a strong blend of technical depth in SoC/RTL design, proven leadership in managing engineering teams, and a strategic understanding of the ASIC development lifecycle and its impact on business objectives.

šŸ“Œ Application Steps

To apply for this SoC / Chip Lead & RTL Design Manager position at Texas Instruments:

  • Submit your application through the provided Oracle Cloud job portal link.

  • Tailor your resume: Emphasize your experience in end-to-end SoC development, chip leadership, RTL design management, PPA optimization, and cross-functional team leadership. Use keywords from the job description such as "SoC," "ASIC," "RTL Design," "Chip Lead," "PPA," "DV," "DFT," "Validation," and "low-power design."

  • Prepare your portfolio: Curate examples of your most impactful projects, focusing on ASIC development successes, leadership achievements, and process improvements. Be ready to discuss these in detail, highlighting your role, the challenges, your solutions, and the quantifiable results.

  • Research Texas Instruments: Familiarize yourself with TI's products, particularly in the industrial sector, their company culture, and their commitment to innovation. Understand their position in the semiconductor market.

  • Practice technical and behavioral questions: Prepare to discuss your technical expertise in RTL design and SoC architecture, as well as your leadership style and problem-solving approaches, using the STAR method (Situation, Task, Action, Result).

āš ļø Important Notice: This enhanced job description includes AI-generated insights and operations industry-standard assumptions. All details should be verified directly with the hiring organization before making application decisions.

Application Requirements

Candidates must have a Bachelor's or Master's in EE or equivalent, with over 12 years of experience in complex SoC/ASIC development and proven leadership in multiple SoC domains. Strong expertise in ARM-based systems, low-power design, and end-to-end SoC lifecycle exposure, including successful tape-outs, is required.