R&D Hardware Design Manager

📍 Job Overview

Job Title: R&D Hardware Design Manager

Company: Keysight Technologies, Inc.

Location: Colorado Springs, Colorado, United States / Santa Rosa, California, United States

Job Type: Full-time

Category: Hardware Engineering / R&D Management

Date Posted: May 01, 2026

Experience Level: 10+ years

Remote Status: On-site

🚀 Role Summary

• Lead a global team of engineers in the design, optimization, and deployment of high-performance ASIC packaging and subsystem solutions for cutting-edge test and measurement products.

• Drive hardware architecture, requirements, and performance specifications in close collaboration with system, IC design, and test engineering teams.

• Investigate and integrate next-generation technologies and industry solutions to maintain Keysight's market leadership in electronic design and measurement.

• Oversee the entire ASIC development lifecycle, from initial concept and technology selection through to manufacturing partner collaboration, characterization, and qualification.

📝 Enhancement Note: This role is critical for Keysight's R&D efforts, focusing on the physical integration of advanced semiconductors into their high-performance test and measurement instruments. The manager will bridge the gap between IC design and final product realization, demanding a strong understanding of both hardware engineering principles and project leadership.

📈 Primary Responsibilities

• Manage the development and system integration of ASIC packages and subsystems, encompassing package design, layout, PCB implementation, RF and high-speed digital design, signal integrity (SI) modeling, power integrity (PI) analysis, and thermo-structural analysis.

• Collaborate closely with system architects, IC designers, and test engineers to define hardware architecture, functional requirements, and performance targets that meet product differentiation and value objectives.

• Identify and select appropriate semiconductor packaging and subsystem technology solutions tailored to the specific requirements of each chip design and instrument application.

• Deliver accurate electrical models to optimize the performance of ICs, packages, and system interconnects, ensuring signal integrity and minimizing performance degradation.

• Provide technical support for instrument development, facilitating the successful deployment and integration of critical ASIC blocks into final products.

• Proactively investigate and evaluate emerging technologies and industry best practices to enhance Keysight's product capabilities and competitive edge.

• Engage with supply chain partners throughout the ASIC development cycle to ensure timely and cost-effective sourcing of materials and manufacturing services.

• Work collaboratively with internal and external manufacturing partners to identify, develop, deploy, and execute new processes for ASIC packaging and subsystem assembly.

• Partner with the reliability engineering team to conduct thorough characterization and qualification of each ASIC, ensuring long-term product stability and performance.

• Drive innovation within the team, fostering a culture of continuous improvement and exploration of new design methodologies and tools.

📝 Enhancement Note: The responsibilities highlight a deep dive into the physical layer of electronic design, crucial for achieving the performance metrics required in high-end test and measurement equipment. The emphasis on global collaboration and external partner management indicates a need for strong communication and negotiation skills.

🎓 Skills & Qualifications

Education:

Experience:

• Minimum of 8+ years of progressive experience in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design.

• Minimum of 5 years of experience in a management or team leadership role, leading multi-disciplinary development teams.

Required Skills:

• Expertise in semiconductor packaging technologies, materials, and associated manufacturing processes.

• Proficient understanding of printed circuit board (PCB) design, implementation, and manufacturing considerations.

• Strong knowledge of RF and microwave theory, with practical experience in RF/microwave circuit design and optimization.

• Demonstrated ability in high-speed digital design principles and methodologies.

• Solid understanding and application of signal integrity (SI) modeling and simulation techniques.

• Experience with power integrity (PI) analysis and design for stable power delivery.

• Knowledge of thermodynamics and thermostructural analysis principles for thermal management and mechanical integrity.

• Excellent understanding of Electrical Engineering fundamentals.

• Proven leadership and people management skills, including team building, performance management, and talent development.

Preferred Skills:

• Familiarity with IC design methodologies, processes, and workflows.

• Experience with materials science principles relevant to electronic hardware.

• Knowledge of Keysight's product portfolio (Oscilloscopes, Signal Generators, Bit-Error Rate Testers, Frequency-Domain Instruments) and their associated design challenges.

• Experience collaborating with global engineering teams and external manufacturing partners.

• Understanding of U.S. export control laws and regulations related to technology.

📝 Enhancement Note: The qualifications emphasize a blend of deep technical expertise in hardware design and packaging, combined with substantial leadership experience. The "preferred skills" suggest a desire for candidates who can quickly integrate into Keysight's specific product development ecosystem and understand the nuances of international compliance.

📊 Process & Systems Portfolio Requirements

Portfolio Essentials:

• Showcase a minimum of two complex hardware development projects where you led the design, integration, or optimization of ASIC packaging, subsystems, or high-performance PCBs.

• Include detailed examples of your involvement in defining hardware architecture and technical requirements for new products.

• Present case studies demonstrating successful signal integrity and power integrity analysis and optimization, highlighting the impact on product performance.

• Provide evidence of your experience in managing cross-functional engineering teams, including project planning, resource allocation, and risk mitigation strategies.

Process Documentation:

• Demonstrate experience in documenting hardware design processes, including design reviews, verification procedures, and qualification protocols.

• Provide examples of workflow optimization initiatives undertaken to improve design cycle times, reduce costs, or enhance product quality.

• Illustrate how you have implemented or leveraged system integration methodologies to ensure seamless performance between ICs, packages, and subsystems.

• Show your approach to developing and following established processes for thermal and structural analysis and their integration into the overall design flow.

📝 Enhancement Note: For a management role in R&D hardware design, the portfolio should reflect not just individual technical contributions but also the ability to guide teams through complex development cycles. Emphasis on process documentation and workflow optimization demonstrates a mature approach to engineering management and continuous improvement.

💵 Compensation & Benefits

Salary Range:

• Based on the provided range of USD $151,800 (MIN) to $253,000 (MAX) annually, with a reference midpoint of $202,400. The final salary will be determined by applicable experience, education, and skills, with most offers falling between the minimum and midpoint.

• Note: For other locations (e.g., Santa Rosa, CA), pay ranges will vary by region. Given the cost of living and typical compensation for senior engineering management roles in California, the salary range for Santa Rosa would likely be at the higher end of, or exceed, the stated range. Researching local compensation benchmarks for Colorado Springs and Santa Rosa specifically for R&D Hardware Design Managers with 10+ years of experience is recommended.

Benefits:

• Medical, dental, and vision insurance plans.

• Health Savings Account (HSA).

• Health Care and Dependent Care Flexible Spending Accounts (FSAs).

• Comprehensive Life, Accident, and Disability insurance coverage.

• Business Travel Accident and Business Travel Health insurance.

• 401(k) retirement savings plan with company contributions.

• Flexible Time Off (FTO) policy and Paid Holidays.

• Paid Family Leave.

• Employee Discounts and Perks.

• Tuition Reimbursement program.

• Adoption Assistance.

• Employee Stock Purchase Plan (ESPP).

• Restricted Stock Units (RSUs).

Working Hours:

• Standard full-time working hours, typically 40 hours per week. While on-site, there may be flexibility in daily schedules, but project deadlines and team collaboration will necessitate consistent availability.

📝 Enhancement Note: The salary range provided is specific to the US market and likely has a primary anchor in the Colorado Springs location. It's crucial to acknowledge the significant difference in cost of living and salary expectations between Colorado Springs and Santa Rosa, California, necessitating a regional adjustment for the latter. The comprehensive benefits package is standard for a large technology firm.

🎯 Team & Company Context

🏢 Company Culture

Industry: Electronic Measurement and Instrumentation, Technology, Semiconductors. Keysight is a global leader in providing advanced electronic measurement solutions, enabling R&D and manufacturing in critical sectors like communications (5G/6G), automotive, aerospace & defense, energy, and semiconductors. Their role in enabling technological advancements is paramount.

Company Size: Approximately 15,000 employees globally. This indicates a large, established organization with structured processes, extensive resources, and a global reach, offering stability and opportunities for broad impact.

Founded: Keysight Technologies was formed in 1999 as a spin-off from Hewlett-Packard. This heritage provides a foundation of innovation, quality, and a deep understanding of the electronics industry.

Team Structure:

• The ASIC Packaging, Subsystem, and Integration team is part of Keysight Laboratories, a world-renowned technology organization. This suggests a highly skilled, specialized group focused on cutting-edge research and development.

• The team likely comprises hardware engineers (RF, digital, SI/PI), mechanical engineers (thermo-structural), and potentially simulation specialists.

Methodology:

• Data-Driven Design: Emphasis on rigorous analysis, modeling, and simulation (SI, PI, thermo-structural) to ensure performance and reliability.

• Agile/Iterative Development: While not explicitly stated, complex hardware development often involves iterative design, prototyping, and testing cycles to meet demanding product specifications.

• Global Collaboration: The role requires seamless interaction with geographically dispersed teams, necessitating strong communication protocols and project management tools.

• Technology Exploration: A core component involves investigating and adopting new technologies to maintain a competitive advantage.

Company Website: https://www.keysight.com/

📝 Enhancement Note: Keysight's culture is rooted in innovation, engineering excellence, and a forward-looking approach to technology. The position within Keysight Laboratories signals a focus on high-impact, advanced R&D rather than day-to-day product line engineering. The company's size and history suggest a structured yet dynamic environment for experienced engineers.

📈 Career & Growth Analysis

Operations Career Level: This is a Senior Management position within Research & Development, specifically leading a critical technical team focused on the physical realization of advanced integrated circuits and subsystems. It requires a blend of deep technical expertise and proven leadership capabilities. The scope involves managing global projects and influencing hardware architecture for major product lines.

Reporting Structure: The R&D Hardware Design Manager will likely report to a Director or Vice President of Engineering within Keysight Laboratories or a related advanced technology division. They will manage a team of specialized hardware engineers.

Operations Impact: The work of this team directly impacts the performance, differentiation, and time-to-market of Keysight's flagship test and measurement products. Success in this role leads to the development of industry-leading instruments that define new standards in communication, semiconductors, and other advanced technology sectors. The manager's decisions on packaging and subsystem design have a direct bearing on product cost, performance envelope, and reliability.

Growth Opportunities:

• Technical Leadership: Progression to Principal Engineer or Chief Architect roles, focusing on highly complex technical challenges or setting technology roadmaps.

• Management Progression: Advancement to Director-level roles, managing larger teams or multiple R&D functions, with broader strategic responsibility.

• Cross-Functional Roles: Opportunities to move into program management, product management, or strategic technology planning roles that leverage deep technical understanding.

• Specialization: Deepening expertise in specific areas like advanced packaging, RF system design, or thermal management, becoming a recognized subject matter expert within Keysight and the industry.

• International Assignments: Potential for roles in other Keysight global R&D centers.

📝 Enhancement Note: This role represents a significant step in a hardware engineering career, moving from individual contribution or team lead to managing a core R&D function. The growth paths are clearly defined for both technical and managerial progression, offering substantial career development within a leading technology company.

🌐 Work Environment

Office Type: The primary location in Colorado Springs is described as a "beautiful development campus" with both office and advanced technology, assembly & machining facilities. This suggests a modern, well-equipped environment designed for innovation and product development. The Santa Rosa location is also implied to be a significant engineering hub.

Office Location(s):

• Colorado Springs, Colorado: A scenic location known for outdoor recreation, with an on-site campus featuring extensive amenities.

Workspace Context:

• Collaborative Environment: The role demands close interaction with global teams, implying a need for effective virtual collaboration tools and on-site teamwork. The campus design likely includes spaces conducive to brainstorming and team meetings.

• Advanced Tools & Technology: Access to state-of-the-art design software (CAD, SI/PI/thermo-structural simulation tools), lab equipment, and potentially prototyping/manufacturing resources within the facility.

• Cross-functional Interaction: Frequent engagement with IC designers, system engineers, test engineers, manufacturing specialists, and supply chain professionals, fostering a dynamic and interconnected work atmosphere.

Work Schedule:

• Primarily on-site in Colorado Springs or Santa Rosa.

• Standard 40-hour work week, with the expectation of flexibility to meet project deadlines and manage global team coordination across different time zones. This may involve occasional early morning or late afternoon calls.

📝 Enhancement Note: The description of the Colorado Springs campus, with its amenities and location, emphasizes a desirable work environment. The need for on-site presence highlights the hands-on nature of hardware development and team leadership in this role.

📄 Application & Portfolio Review Process

Interview Process:

• Initial Screening: HR or Recruiter call to assess basic qualifications, interest, and alignment with company culture.

• Hiring Manager Interview: In-depth discussion with the hiring manager (Abdelkader Oukaci) focusing on leadership experience, technical depth in hardware design/packaging, and team management philosophy. Expect behavioral questions related to past project successes and challenges.

• Technical Panel Interview: Meetings with key team members and cross-functional stakeholders (e.g., IC design leads, system architects). This will involve detailed technical questions on ASIC packaging, SI/PI, RF design, thermo-structural analysis, and your approach to problem-solving.

• Portfolio Presentation: A dedicated session where you will present selected projects from your portfolio. This is a critical step to demonstrate your technical contributions, leadership impact, and ability to articulate complex technical concepts and project outcomes.

• Final Interview: Potentially with a senior leader (e.g., Director of Engineering) to discuss strategic alignment, long-term vision for the team, and cultural fit.

Portfolio Review Tips:

• Curate Strategically: Select 2-3 projects that best showcase your leadership in ASIC packaging, subsystem integration, and managing complex hardware development cycles. Prioritize projects with significant technical challenges and measurable impact.

• Structure Your Narrative: For each project, clearly articulate the problem statement, your role and responsibilities, the technical solutions implemented (especially SI/PI, thermal, RF aspects), the challenges faced, how you led your team to overcome them, and the quantifiable results (e.g., performance improvements, cost reductions, schedule adherence).

• Highlight Leadership: Emphasize your management approach, how you motivated your team, managed resources, fostered collaboration, and made critical technical decisions.

• Data & Visuals: Use clear diagrams, schematics, simulation plots, and performance data to illustrate technical concepts and outcomes. Ensure visual clarity and conciseness.

• Prepare for Deep Dives: Be ready to answer detailed technical questions about your design choices, simulation methodologies, and problem-solving approaches.

Challenge Preparation:

• Technical Case Study: You may be given a hypothetical design challenge related to ASIC packaging or subsystem integration for a new test instrument. Prepare to outline your approach to defining requirements, selecting technologies, performing analysis, and managing the development process.

• Leadership Scenarios: Be ready to discuss how you would handle common management situations, such as resolving team conflicts, motivating underperforming engineers, managing conflicting priorities, or communicating complex technical roadmaps to stakeholders.

• Strategic Thinking: Prepare to discuss your vision for the future of ASIC packaging and subsystem integration in the context of Keysight's product roadmap and industry trends.

📝 Enhancement Note: The interview process is designed to thoroughly assess both technical acumen and leadership capabilities. The portfolio presentation is a key opportunity to distinguish yourself by clearly demonstrating your impact and expertise in managing complex hardware development.

🛠 Tools & Technology Stack

Primary Tools:

• EDA Software: Expertise in industry-standard Electronic Design Automation (EDA) tools for schematic capture, PCB layout, and simulation. This includes tools such as:

  • Cadence: Virtuoso (for IC/package design), Allegro/OrCAD (for PCB design).
  • Synopsys: For IC design tools, potentially used in collaboration.
  • Altium Designer: Another popular PCB design and simulation suite.

• Simulation Tools:

  • Signal Integrity (SI) / Power Integrity (PI): Keysight's own suite (e.g., ADS - Advanced Design System, EMPro), Ansys (SIwave, HFSS), Cadence (Sigrity).
  • Electromagnetic (EM) Simulation: HFSS, CST Studio Suite, Keysight ADS EMPro.
  • Thermo-structural Analysis: ANSYS Mechanical, COMSOL Multiphysics.

• IC Design Tools: Familiarity with flows for ASICs and potentially FPGAs, including synthesis, place-and-route, and verification tools from vendors like Synopsys, Cadence, and Xilinx.

Analytics & Reporting:

• Data Analysis Tools: Proficiency in using data analysis software for performance metrics, reliability data, and project tracking. This could include standard office suites (Excel, Google Sheets) and potentially more advanced tools like JMP (from SAS), Python with libraries (Pandas, NumPy), or R.

• Project Management Software: Tools like Jira, Confluence, Microsoft Project, or Asana for task management, documentation, and team collaboration.

CRM & Automation:

• While not directly managing sales/marketing processes, understanding CRM systems (e.g., Salesforce) might be beneficial for context on product lifecycle and customer feedback.

• Automation tools within EDA software or scripting languages (e.g., Python, Tcl) for design flow automation, data processing, and report generation.

• Version Control Systems: Git or similar for managing design files and code.

📝 Enhancement Note: The technology stack is heavily focused on specialized engineering simulation and design software critical for high-performance hardware development. Proficiency in these tools, especially for SI/PI and thermal analysis, is paramount. Experience with Keysight's own tools (ADS, EMPro) is a significant advantage.

👥 Team Culture & Values

Operations Values:

• Innovation: A drive to push the boundaries of technology and develop novel solutions for complex engineering challenges.

• Excellence: A commitment to high standards in design, analysis, and execution, ensuring product performance, reliability, and quality.

• Collaboration: A strong emphasis on teamwork, cross-functional partnerships, and open communication across global teams and disciplines.

• Customer Focus: Ultimately, the goal is to deliver solutions that provide significant value and competitive advantage to Keysight's customers.

• Integrity: Upholding ethical standards in all business dealings and technical practices.

Collaboration Style:

• Cross-functional Integration: The role requires deep collaboration with IC design, system engineering, product development, manufacturing, and reliability teams. This necessitates clear communication channels and a shared understanding of project goals.

• Process-Oriented: A systematic approach to design, verification, and problem-solving, with an emphasis on following established protocols while also being open to process improvements.

• Knowledge Sharing: Encouraging an environment where engineers share insights, best practices, and lessons learned to foster collective growth and accelerate innovation.

• Mentorship: Experienced team members are expected to guide and mentor junior engineers, fostering a learning culture.

📝 Enhancement Note: Keysight's values emphasize engineering rigor and collaborative innovation. The culture is likely one where technical expertise is highly respected, and teamwork is essential for achieving complex R&D objectives.

⚡ Challenges & Growth Opportunities

Challenges:

• Managing Global Teams: Coordinating work across different time zones, cultures, and engineering practices requires strong leadership, communication, and project management skills.

• Rapid Technological Evolution: The fast-paced nature of the semiconductor and test & measurement industries demands continuous learning and adaptation to new technologies, materials, and design methodologies.

• Balancing Performance, Cost, and Schedule: Achieving breakthrough performance in test & measurement instruments often involves complex trade-offs between technical capabilities, manufacturing costs, and aggressive development timelines.

• Integration Complexity: Ensuring seamless integration of cutting-edge ASICs, advanced packaging, and intricate subsystems into high-performance instruments presents significant technical hurdles.

• Export Control Compliance: Navigating U.S. export control regulations for non-U.S. persons working with sensitive technologies adds a layer of complexity to team management and hiring.

Learning & Development Opportunities:

• Advanced Technical Training: Access to internal and external training programs on the latest advancements in ASIC packaging, RF design, SI/PI, thermal management, and materials science.

• Industry Conferences & Seminars: Opportunities to attend and present at leading industry events (e.g., IEEE workshops, ECTC, DesignCon) to stay abreast of trends and network with peers.

• Leadership Development Programs: Keysight likely offers programs to enhance management skills, strategic thinking, and cross-functional leadership.

• Mentorship: Access to senior technical leaders and experienced managers within Keysight for guidance and career development advice.

• Exposure to Diverse Technologies: Working on a wide range of high-performance instruments across various market segments provides broad technical exposure.

📝 Enhancement Note: The challenges are typical for a high-tech R&D management role, requiring adaptability and strong problem-solving skills. The growth opportunities are substantial, offering clear paths for both technical and managerial advancement within a leading technology company.

💡 Interview Preparation

Strategy Questions:

• Technical Strategy: "Describe your approach to selecting an ASIC packaging technology for a new high-speed digital product that requires exceptional signal integrity and thermal management. What factors would you consider, and what simulation techniques would you employ?"

  • Preparation: Be ready to discuss trade-offs between different package types (e.g., BGA, WLCSP, advanced substrates), the importance of substrate materials, interposer technology, and how SI/PI/thermal analysis informs these decisions.

• Team Leadership Strategy: "How do you foster innovation and collaboration within a globally distributed engineering team? Provide an example of how you've successfully managed a team through a challenging project with tight deadlines."

  • Preparation: Discuss strategies for effective communication across time zones, building trust, motivating engineers, conflict resolution, and using project management tools to ensure alignment.

• Process Optimization Strategy: "What is your methodology for developing and improving hardware design and integration processes? How do you ensure these processes are adopted and followed by your team?"

  • Preparation: Be prepared to talk about design review gates, documentation standards, continuous improvement frameworks (e.g., Lean, Six Sigma principles), and change management.

Company & Culture Questions:

• "Based on your understanding of Keysight and the test & measurement industry, what do you see as the biggest technical challenges for ASIC packaging and subsystem integration in the next 3-5 years?"

  • Preparation: Research Keysight's product lines, recent technological advancements (e.g., 5G/6G, AI hardware), and industry trends.

• "How do you align your team's technical direction with broader company objectives and product roadmaps?"

  • Preparation: Discuss how you gather input, translate strategic goals into actionable engineering tasks, and communicate progress and challenges to senior leadership.

• "Describe a time you had to work with a difficult cross-functional stakeholder. How did you manage the relationship and achieve the project goals?"

  • Preparation: Use the STAR method (Situation, Task, Action, Result) to illustrate your collaboration and problem-solving skills.

Portfolio Presentation Strategy:

• Focus on Impact: For each project, quantify the results. Did you improve performance by X%, reduce signal loss by Y dB, meet thermal requirements within Z degrees, or deliver on schedule/under budget?

• Demonstrate Leadership: Clearly articulate your role in decision-making, team guidance, and problem-solving. Use "I" for your direct contributions and "we" for team achievements.

• Technical Depth, Managerial Breadth: Be prepared to go deep on technical details when asked, but also demonstrate your understanding of the broader project lifecycle, resource management, and stakeholder communication.

• Visual Aids: Use clear, concise slides with relevant diagrams, charts, and data. Avoid text-heavy slides. Practice your delivery to ensure you can convey complex information effectively within the allotted time.

📝 Enhancement Note: The interview questions are designed to probe your technical depth, leadership capabilities, strategic thinking, and cultural fit. A strong portfolio presentation that clearly articulates your impact and leadership is crucial for success.

📌 Application Steps

To apply for this R&D Hardware Design Manager position:

• Submit your application through the Keysight Technologies job portal, ensuring all required fields are completed accurately.

• Curate Your Resume: Tailor your resume to highlight your 8+ years of hardware design experience and 5+ years of leadership experience. Emphasize keywords related to ASIC packaging, subsystem integration, RF/microwave design, SI/PI analysis, and team management. Quantify your achievements with specific metrics.

• Prepare Your Portfolio: Select 2-3 key projects that best demonstrate your technical expertise and leadership in managing complex hardware development. Ensure each case study clearly outlines the challenge, your role, the technical solutions, and the measurable outcomes.

• Practice Your Presentation: Rehearse your portfolio presentation to ensure it is concise, engaging, and effectively communicates your impact. Be prepared to answer detailed technical and behavioral questions.

• Research Keysight: Familiarize yourself with Keysight's products, markets, recent innovations, and company culture. Understand their position in the test and measurement industry and the role of Keysight Laboratories.

⚠️ Important Notice: This enhanced job description includes AI-generated insights and operations industry-standard assumptions. All details should be verified directly with the hiring organization before making application decisions.