Physical Design - Director

📍 Job Overview

Job Title: Physical Design - Director
Company: Qualcomm India Private Limited
Location: Chennai, Tamil Nadu, India
Job Type: FULL_TIME
Category: Hardware Engineering / IC Design Operations
Date Posted: 2025-10-13
Experience Level: 20+ Years (Director Level)
Remote Status: On-site

🚀 Role Summary

• Lead and independently manage the entire Netlist-to-GDSII physical design flow for complex ICs, ensuring predictable convergence and high-quality execution.
• Drive critical aspects of static timing analysis (STA) and timing closure at both block and SOC levels, including ECO generation and validation.
• Foster strong collaboration with cross-functional teams, including RTL design, DFT, and PNR (Place and Route) teams, to resolve intricate technical challenges.
• Oversee the convergence of high-frequency, multi-voltage designs, demonstrating a deep understanding of clock networks and timing-critical paths.
• Provide technical leadership and mentorship to a team of engineers, guiding them through complex deep sub-micron design challenges and solutions.

📝 Enhancement Note: This role is positioned as a Director-level IC Design position. While the provided description focuses on technical execution, the "Director" title implies significant leadership, strategic planning, team management, and cross-functional stakeholder engagement beyond individual technical contributions. The "Operations" aspect is inherent in managing complex design flows, ensuring efficiency, and driving predictable outcomes within a highly technical engineering discipline.

📈 Primary Responsibilities

• Independently plan, execute, and drive the Netlist-to-GDSII physical design implementation for advanced semiconductor designs.
• Develop and refine methodologies for static timing analysis (STA), timing closure, and ECO generation to ensure design performance targets are met consistently.
• Collaborate closely with DFT (Design for Testability) engineers to integrate testability features and resolve related physical design challenges.
• Work in tandem with PNR (Place and Route) teams to optimize design layouts, manage routing congestion, and ensure signal integrity.
• Analyze and address deep sub-micron design issues such as skew analysis, clock divergence, signal integrity, and Design for Manufacturability (DFM) challenges.
• Manage and optimize clock networks, ensuring low skew and reliable clock distribution across the entire chip.
• Conduct in-depth circuit-level analysis of timing-critical paths to identify and resolve performance bottlenecks.
• Develop, maintain, and execute Tcl/Perl scripts to automate and streamline physical design flows and tasks.
• Lead and mentor a team of physical design engineers, providing technical guidance, performance feedback, and development opportunities.
• Oversee physical verification processes, including DRC (Design Rule Checking) and LVS (Layout Versus Schematic), to ensure design compliance and sign-off readiness.

📝 Enhancement Note: The core responsibilities highlight a blend of hands-on technical execution and leadership. For a Director-level role, responsibilities would extend to strategic planning of design flows, resource allocation, defining technical roadmaps for physical design, and managing budget aspects related to design tools and personnel. The emphasis on "independent planning and execution" and "leading block level or chip level" activities strongly suggests a senior leadership role with accountability for project success.

🎓 Skills & Qualifications

Education:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field with 8+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field with 7+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field with 6+ years of Hardware Engineering or related work experience.
• Alternatively, and more critically for this Director role: Master's/Bachelor's Degree in Electrical/Electronics Science Engineering with at least 20+ years of experience in IC design, with specific experience in leading block level or chip level Timing Closure & Physical Design activities.

Experience:

• Extensive experience in the full RTL to GDSII implementation flow.
• Proven track record of successfully leading and delivering complex IC physical design projects.
• Deep understanding of deep sub-micron design challenges and advanced solutions.

Required Skills:

• Netlist-to-GDSII Execution: Proven ability to independently manage and deliver the entire physical design flow.
• Static Timing Analysis (STA): Strong grasp of STA principles, methodologies, and tools for timing closure.
• Timing Closure & ECO Generation: Expertise in achieving predictable timing convergence and generating/validating Engineering Change Orders (ECOs).
• High-Frequency & Multi-Voltage Design: Experience with the complexities of converged high-frequency and multi-voltage designs.
• Clock Network Design: Thorough understanding of clock tree synthesis (CTS), clock distribution, and skew management.
• Scripting Proficiency: Advanced proficiency in Tcl and Perl scripting for automation of physical design tasks.
• Problem-Solving: Exceptional analytical and problem-solving skills to tackle complex technical challenges.
• Communication Skills: Excellent verbal and written communication skills for effective collaboration and reporting.
• Physical Verification: Comprehensive knowledge of DRC, LVS, and other physical verification sign-off requirements.
• Floor-planning & Placement: Expertise in floor-planning, placement strategies, and optimization techniques.
• Routing & Crosstalk Avoidance: Skilled in advanced routing techniques and crosstalk mitigation strategies.

Preferred Skills:

• Experience with advanced process nodes (e.g., 7nm, 5nm, 3nm).
• Familiarity with Design for Manufacturability (DFM) and Design for Reliability (DFR) considerations.
• Exposure to signal integrity analysis and mitigation techniques.
• Experience in leading and managing a team of physical design engineers.
• Knowledge of DFT methodologies and their impact on physical design.

📝 Enhancement Note: The "Director" title strongly suggests that the 20+ years of IC design experience is the primary requirement, superseding the general Hardware Engineering experience listed first. The minimum qualifications should be interpreted through the lens of a senior leadership role, where extensive practical experience and proven leadership in physical design are paramount.

📊 Process & Systems Portfolio Requirements

Portfolio Essentials:

• End-to-End Flow Demonstration: Showcase a comprehensive portfolio of at least 2-3 complex IC designs (block or chip level) where you played a leading role in the Netlist-to-GDSII process.
• Timing Closure Case Studies: Detailed examples of how you achieved challenging timing closure targets, including specific methodologies, tools used, and quantifiable results (e.g., timing improvements, reduced iterations).
• ECO Management: Documentation of your experience with ECO generation and implementation, highlighting your ability to resolve critical timing or functional issues post-tapeout or late-stage design.
• Scripting Automation Examples: Provide examples of Tcl/Perl scripts or workflows you developed to automate repetitive or complex physical design tasks, demonstrating efficiency gains.
• Problem-Solving Scenarios: Case studies illustrating how you tackled and resolved significant deep sub-micron design challenges (e.g., clock skew, signal integrity, DFM issues).

Process Documentation:

• Methodology Definition: Evidence of your ability to define, document, and implement robust physical design methodologies and flows.
• Cross-Functional Collaboration: Examples of documented processes for seamless collaboration with RTL, DFT, and PNR teams, including issue resolution frameworks.
• Performance Tracking: Demonstrations of how you tracked and reported on key physical design metrics (e.g., PPA - Power, Performance, Area; timing closure progress; design rule compliance).

📝 Enhancement Note: For a Director-level role, the portfolio should emphasize strategic decision-making, methodology development, and team enablement, not just personal technical execution. The focus should be on how you led teams to achieve results, what methodologies you established, and the impact of your leadership on project outcomes and efficiency.

💵 Compensation & Benefits

Salary Range: Based on Qualcomm's global compensation standards for Director-level engineering positions in India, and considering the extensive experience (20+ years) required for this role, the estimated annual compensation would likely fall within the range of ₹50,00,000 to ₹90,00,000 (INR). This range accounts for base salary, potential bonuses, and stock options.

Methodology: This estimate is derived from industry benchmarks for senior engineering leadership roles in major semiconductor companies operating in India, specifically for individuals with over two decades of specialized IC design experience. Factors considered include the high level of technical expertise required, the leadership responsibilities, and the cost of living in Chennai, India.

Benefits:

• Comprehensive Health Insurance: Medical, dental, and vision coverage for employees and dependents.
• Retirement Savings Plans: Provident Fund (PF) contributions and potential for additional retirement savings schemes.
• Performance Bonuses: Annual performance-based bonuses tied to individual and company achievements.
• Stock Options/RSUs: Potential for stock grants (Restricted Stock Units) as part of the overall compensation package.
• Paid Time Off: Generous vacation days, sick leave, and public holidays.
• Professional Development: Opportunities for training, certifications, and attending industry conferences.
• Employee Assistance Programs: Support services for personal and professional well-being.
• Relocation Assistance: If applicable, support for relocation to Chennai.

Working Hours: The standard working hours are typically 40 hours per week, Monday to Friday. However, given the Director-level responsibility and the nature of IC design projects, flexibility and occasional extended hours may be required to meet critical project deadlines and ensure successful tape-outs.

📝 Enhancement Note: The salary range is an estimate for a Director in India. Actual compensation will depend on Qualcomm's internal compensation structure, the candidate's specific experience, and negotiation. The emphasis on "20+ years" and "Director" is key to justifying this higher-end estimate.

🎯 Team & Company Context

🏢 Company Culture

Industry: Semiconductors and Telecommunications. Qualcomm is a global leader in wireless technology, designing and manufacturing semiconductors, software, and services related to wireless technology. Company Size: Qualcomm is a large multinational corporation, employing tens of thousands of people worldwide. This implies a structured environment with established processes, extensive resources, and opportunities for diverse career paths. Founded: 1985. With a long history, Qualcomm has a deep-rooted culture of innovation and technological advancement.

Team Structure:

• IC Design Department: This role sits within Qualcomm's robust Engineering Group, specifically focusing on Hardware Engineering.
• Reporting Structure: As a Director, you would likely report to a Vice President or Senior Director of Engineering, overseeing a team of managers and senior engineers.
• Cross-functional Collaboration: The role necessitates close collaboration with various internal teams, including RTL design, DFT, PNR, verification, process technology, and product management, to ensure seamless chip development.

Methodology:

• Data-Driven Decisions: Qualcomm emphasizes data-driven approaches in engineering, utilizing extensive simulations, analysis, and metrics to guide design decisions and problem-solving.
• Process Optimization: Continuous improvement of design flows and methodologies is a core tenet, aiming for increased efficiency, predictability, and higher quality silicon.
• Innovation & Research: The company fosters a culture of innovation, encouraging exploration of new technologies and design techniques to maintain a competitive edge.

Company Website: https://www.qualcomm.com/

📝 Enhancement Note: The "Operations" context for this role within Qualcomm is the meticulous management and optimization of complex, high-stakes engineering processes (IC design flow) to ensure predictable delivery of high-performance semiconductor products. It's about operational excellence in a highly technical domain.

📈 Career & Growth Analysis

Operations Career Level: This is a senior leadership role at the Director level within the Hardware Engineering division. It signifies a high degree of technical expertise, extensive experience in IC physical design, and proven leadership capabilities. The scope includes strategic direction, team management, and accountability for critical project phases.

Reporting Structure: As a Director, you will likely report to a VP or Senior Director of Engineering. Your direct reports could include multiple managers, leads, and senior individual contributors responsible for specific aspects of the physical design flow. You will also be a key stakeholder interacting with other engineering directors and VPs across different functional groups.

Operations Impact: The Director of Physical Design has a direct and profound impact on Qualcomm's ability to deliver cutting-edge semiconductor products on time and within budget. Successful physical design operations are critical for achieving target performance, power, and area specifications, which directly influence the competitiveness and market success of Qualcomm's chipsets. Your strategic decisions and team's execution directly contribute to revenue generation and market leadership.

Growth Opportunities:

• Executive Leadership: Potential to advance to higher leadership positions, such as VP of Engineering or Senior Director of a broader engineering organization.
• Strategic Planning: Opportunity to influence the long-term technology roadmap and design strategy for Qualcomm's semiconductor products.
• Global Team Management: Experience in managing and developing diverse, global engineering teams.
• Cross-Functional Leadership: Broaden influence by leading initiatives that span multiple engineering disciplines and business units.
• Technical Specialization: Deepen expertise in emerging areas of IC design, such as advanced node physical design, power integrity, or novel architectures.

📝 Enhancement Note: The growth trajectory for a Director in a company like Qualcomm is typically towards higher levels of strategic responsibility, broader scope of management, and potentially into executive leadership roles. The emphasis is on shaping the future of the company's engineering capabilities.

🌐 Work Environment

Office Type: This is an on-site role at Qualcomm's facilities in Chennai. The environment is likely a modern, corporate office space designed for engineering collaboration and productivity. Office Location(s): Chennai, Tamil Nadu, India. This location hosts significant engineering talent for Qualcomm.

Workspace Context:

• Collaborative Spaces: The office will likely feature a mix of individual workstations and collaborative areas designed for team meetings, design reviews, and brainstorming sessions.
• Advanced Tooling: Access to high-performance computing clusters, sophisticated EDA (Electronic Design Automation) tools, and robust network infrastructure is standard for physical design work.
• Team Interaction: Frequent face-to-face interactions with direct reports, peers, and cross-functional team members are expected, fostering a dynamic and interactive work environment.

Work Schedule: While the standard work week is typically 40 hours, the demanding nature of IC design, particularly around tape-out deadlines, often requires flexibility and dedication beyond standard hours. This is common for senior engineering roles where project success is paramount.

📝 Enhancement Note: The "operations" aspect of the work environment refers to the structured setup and readily available resources that enable efficient execution of the physical design process.

📄 Application & Portfolio Review Process

Interview Process:

• Initial Screening: HR or a senior engineering recruiter will conduct an initial call to assess basic qualifications, experience level, and cultural fit.
• Technical Interviews (Multiple Rounds): Expect several in-depth technical interviews focusing on:
  • Physical Design Fundamentals: Deep dives into STA, timing closure, PNR, clock tree synthesis, and physical verification.
  • Leadership & Management: Questions about your experience leading teams, managing complex projects, resolving conflicts, and strategic planning.
  • Problem-Solving Scenarios: Hypothetical or past challenges where you had to devise solutions for critical design issues.
  • Methodology & Process: Discussions on how you define, implement, and improve design flows and operational processes.
• Portfolio Review: A dedicated session where you will present key projects from your portfolio, detailing your role, challenges faced, solutions implemented, and outcomes achieved. This is a critical stage for demonstrating your leadership and technical depth.
• Cross-Functional Interview: A session with a peer director or senior manager from a related team (e.g., RTL, DFT) to assess collaboration skills.
• Final Round: Typically with a senior executive (VP/Senior Director) for final assessment of leadership potential and strategic alignment.

Portfolio Review Tips:

• Focus on Leadership: For a Director role, emphasize your leadership in guiding teams, defining strategies, and making critical decisions, not just individual contributions.
• Quantify Impact: Use metrics (e.g., percentage improvement in timing, reduction in ECOs, PPA gains, schedule adherence) to demonstrate the tangible results of your work and your team's efforts.
• Structure Your Narrative: For each project, clearly articulate the problem, your strategic approach, the methodologies employed, the challenges overcome, your team's execution, and the final outcome.
• Highlight Process Improvements: Showcase instances where you improved design flows, introduced new tools, or optimized operational processes for greater efficiency and predictability.
• Be Prepared for Deep Dives: Anticipate detailed questions about the technical intricacies of your presented projects.

Challenge Preparation:

• Simulated Design Problem: You might be given a hypothetical complex timing closure or placement challenge and asked to outline your approach, key considerations, and potential solutions.
• Methodology Design: Be ready to discuss how you would establish or improve a physical design flow for a new product or technology node.
• Team Management Scenario: You could be presented with a scenario involving team conflict, underperformance, or a critical project delay, and asked how you would manage it.

📝 Enhancement Note: The emphasis on "Director" means the interview process will heavily scrutinize leadership, strategic thinking, and the ability to manage complex operational processes and teams, alongside technical acumen.

🛠 Tools & Technology Stack

Primary Tools:

• EDA Suites: Deep expertise in industry-leading EDA tools for physical design, such as Cadence (e.g., Genus, Innovus, Tempus, Voltus, Liberate) and Synopsys (e.g., Design Compiler, ICC II, Fusion Compiler, PrimeTime, StarRC, IC Validator).
• Scripting Languages: Advanced proficiency in Tcl and Perl for flow automation, customization, and integration. Python may also be beneficial.
• Databases & Version Control: Familiarity with design databases and version control systems (e.g., Git, Perforce) for managing design data.

Analytics & Reporting:

• Timing Analysis Tools: Proficiency with tools like PrimeTime (Synopsys) or Tempus (Cadence) for sign-off STA.
• Power Analysis Tools: Experience with tools like Voltus (Cadence) or PrimePower (Synopsys) for power integrity analysis and sign-off.
• Reporting & Visualization: Ability to generate and interpret reports from EDA tools and potentially use scripting to create custom dashboards or summaries of design metrics.

CRM & Automation:

• Project Management Tools: While not a CRM in the traditional sense, familiarity with project management and tracking tools (e.g., Jira, internal Qualcomm systems) for managing design tasks and schedules is expected.
• Flow Management Systems: Experience with or the ability to develop custom scripting or flow management tools to orchestrate the complex sequence of physical design steps.
• Integration Tools: Understanding of how different EDA tools integrate within a larger design flow and how to manage these integrations.

📝 Enhancement Note: As a Director, you are expected to not only be proficient with these tools but also to understand their strategic application, evaluate new tools, and guide your team in leveraging them effectively to meet performance, power, and area targets. The focus is on how these tools support the operational efficiency of the design process.

👥 Team Culture & Values

Operations Values:

• Excellence & Predictability: A commitment to delivering high-quality silicon with predictable outcomes, meeting performance, power, and area targets consistently.
• Innovation: Encouraging new ideas and advanced methodologies to push the boundaries of IC design and overcome complex challenges.
• Collaboration: Fostering a team-oriented environment where open communication and mutual support are valued across engineering disciplines.
• Accountability: Taking ownership of technical deliverables and project success, driving issues to resolution with a sense of responsibility.
• Efficiency: Continuously seeking ways to optimize design flows, reduce iteration times, and improve overall engineering productivity.

Collaboration Style:

• Proactive Engagement: Actively engaging with RTL designers, DFT engineers, PNR teams, and other stakeholders early and often to prevent issues and ensure alignment.
• Data-Driven Discussions: Basing technical discussions and decisions on solid data, simulation results, and analysis from EDA tools.
• Constructive Feedback: Creating an environment where constructive feedback is welcomed and used for continuous improvement of designs and processes.
• Knowledge Sharing: Promoting a culture of sharing best practices, lessons learned, and technical insights across the team and with collaborating groups.

📝 Enhancement Note: The "Operations" aspect here refers to the ingrained behaviors and principles that enable the physical design team to function as a highly efficient and effective unit, consistently delivering on its complex technical mandates.

⚡ Challenges & Growth Opportunities

Challenges:

• Advanced Node Complexity: Navigating the intricate design rules, lithography challenges, and performance trade-offs associated with cutting-edge process nodes.
• Aggressive PPA Targets: Meeting increasingly demanding Power, Performance, and Area (PPA) requirements for next-generation chipsets in highly competitive markets.
• Managing Large Teams: Leading and motivating a diverse team of experienced engineers, ensuring alignment and high performance across multiple projects.
• Cross-Functional Dependencies: Effectively managing interdependencies and potential conflicts with other engineering groups to ensure seamless project progression.
• Rapid Technological Evolution: Keeping pace with the fast-evolving landscape of EDA tools, design methodologies, and semiconductor technology.

Learning & Development Opportunities:

• Strategic Leadership Training: Access to executive coaching and leadership development programs to hone strategic planning and management skills.
• Advanced Technology Exposure: Opportunities to work on groundbreaking technologies and influence the future direction of Qualcomm's product portfolio.
• Industry Conferences: Participation in leading semiconductor industry conferences (e.g., DAC, ICCAD) to stay abreast of the latest trends and network with peers.
• Mentorship Programs: Access to senior leaders within Qualcomm for mentorship and career guidance.
• Specialized Technical Deep Dives: Opportunities to lead or participate in R&D initiatives for specific technical areas within physical design.

📝 Enhancement Note: The challenges are framed to highlight areas where a Director's strategic thinking and leadership are crucial for success, and the growth opportunities are geared towards developing a seasoned executive.

💡 Interview Preparation

Strategy Questions:

• "Describe a time you had to lead a team through a particularly challenging timing closure. What was your strategy, what were the key hurdles, and what was the outcome?" (Focus on leadership, problem-solving, and quantifiable results.)
• "How would you establish a new physical design flow for a novel architecture or an advanced process node at Qualcomm?" (Assess your methodology development, strategic planning, and understanding of operational processes.)
• "Imagine a critical PPA target is being missed late in the design cycle. What steps would you take to diagnose the issue, what trade-offs would you consider, and how would you communicate this to stakeholders?" (Tests diagnostic skills, decision-making under pressure, and communication.)

Company & Culture Questions:

• "What do you know about Qualcomm's role in the semiconductor industry, and how do you see physical design contributing to our strategic goals?" (Demonstrate research on Qualcomm and an understanding of the business impact of your role.)
• "Describe your leadership style and how you foster a collaborative and high-performing engineering culture." (Assess alignment with Qualcomm's values and your approach to team management.)
• "How do you ensure your team stays current with the latest EDA tools and physical design methodologies?" (Focus on continuous learning and operational efficiency.)

Portfolio Presentation Strategy:

• Executive Summary First: Start with a high-level overview of the project's goals, your role as a leader, and the key achievements.
• Focus on Impact & Strategy: For each project, highlight the strategic decisions you made, the operational challenges you addressed, and the business impact of your team's success (PPA, schedule, cost).
• Quantify Everything Possible: Use data and metrics to back up your claims about performance improvements, efficiency gains, or problem resolution.
• Be Ready for Technical Deep Dives: While focusing on leadership, be prepared to drill down into the technical specifics of your presented projects when asked.
• Showcase Team Leadership: Explain how you motivated and guided your team to achieve the results.

📝 Enhancement Note: The interview preparation advice is tailored for a Director-level role, emphasizing strategic thinking, leadership, and the operational impact of physical design, rather than just individual technical execution.

📌 Application Steps

To apply for this Physical Design Director position:

• Submit Your Application: Utilize the provided application link on the Qualcomm Careers website.
• Curate Your Portfolio: Prepare a concise yet impactful portfolio that highlights 2-3 of your most significant IC design leadership projects. Focus on your role in Netlist-to-GDSII execution, timing closure successes, team leadership, and quantifiable results.
• Tailor Your Resume: Ensure your resume clearly articulates your 20+ years of IC design experience, emphasizing leadership responsibilities, strategic contributions, and specific achievements in physical design and timing closure. Use keywords relevant to advanced nodes, EDA tools, and management.
• Research Qualcomm: Familiarize yourself with Qualcomm's current product lines, recent innovations, and any public information regarding their semiconductor technology and design philosophy. Understand how physical design operations contribute to their business objectives.
• Prepare for Technical & Leadership Interviews: Practice articulating your experience with complex design challenges, your approach to team management, and your vision for optimizing physical design operations. Be ready to discuss your portfolio in detail.

⚠️ Important Notice: This enhanced job description includes AI-generated insights and industry-standard assumptions for a senior leadership role in the semiconductor industry. All details, particularly regarding salary and specific interview processes, should be verified directly with the hiring organization (Qualcomm) during the application and interview stages.